Factory Lead Time  

12 Weeks

Package / Case  

357-BBGA

Surface Mount  

YES

Operating Temperature  

0°C~95°C TA

Packaging  

Tray

Series  

MPC8xx

Published  

2002

JESD-609 Code  

e0

Part Status  

Obsolete

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

357

ECCN Code  

5A002.A.1

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.31.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

245

Supply Voltage  

1.8V

Terminal Pitch  

1.27mm

Time@Peak Reflow Temperature-Max (s)  

30

Base Part Number  

MPC885

JESD-30 Code  

S-PBGA-B357

Power Supplies  

1.83.3V

Speed  

80MHz

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Bit Size  

32

Address Bus Width  

32

Boundary Scan  

YES

Low Power Mode  

YES

External Data Bus Width  

32

Format  

FIXED POINT

Integrated Cache  

YES

Voltage - I/O  

3.3V

Ethernet  

10Mbps (3), 10/100Mbps (2)

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

No

RAM Controllers  

DRAM

USB  

USB 2.0 (1)

Additional Interfaces  

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Co-Processors/DSP  

Communications; CPM, Security; SEC

Voltage - Supply (Max)  

1.9V

Voltage - Supply (Min)  

1.7V

Security Features  

Cryptography

Height Seated (Max)  

2.52mm

Length  

25mm

RoHS Status  

Non-RoHS Compliant